Semiconductor wafer cleaning brush (post-CMP and wafer handling)

Name: "Semiconductor wafer cleaning brush (post-CMP and wafer handling)"
Rating: 5 (638 reviews)

SKU: 5101512672

Model: 3848587661

Product Details

Product Specification

Type	Semiconductor precision brush	Model	Custom-made to tool drawing: disc diameter, centre hole, bristle height and density per chamber.
Params	Disc outer diameter and centre hole per tool; bristle height and density specified per chamber; PVA roller dimensions per cleaner model; ESD-safe grades; particle-shedding limits agreed at sample stage; Class 100,000 cleanroom manufacture.	Material	PVA sponge, PP, nylon, PBT and abrasive nylon filament; ESD-safe and low-particle grades; PEEK components where chemical resistance is required.
Applicable Industry	Semiconductor wafer fabrication; post-CMP cleaning; PCB and PCBA manufacturing; 3C electronics and display; LED and photovoltaic cell production; precision optics.

Feature

Non-scratching contact at controlled pressure for wafers and coated surfaces. Engineered filament density removes slurry and particles without residue. Class 100,000 cleanroom production with batch traceability. Fits major single-wafer and batch cleaner platforms to drawing.